VIA AMOS-3007

Powered by a fanless 1.5GHz Intel^® Atom^® quad-core processor, the VIA AMOS-3007 ruggedized embedded system delivers advanced performance for wide array of compute, information display, Industrial IoT, fleet management, and related edge use cases.

With its ruggedized ultra-compact form factor measuring just 170mm (W) x 48.5mm (H) x 126mm (D) and Wall and VESA mounting options, the VIA AMOS-3007 can be easily deployed in even the most space-constrained locations. Its wide operating temperature range from -20°C to 70°C ensures reliable operation in the most demanding environments.

Comprehensive support for modern and legacy peripherals and displays is provided by the system’s rich I/O feature set that includes two Gigabit Ethernet, two USB 3.0, two lockable USB 2.0, two RS-232/422/485 COM, and one DIO port for 8-bit GPIO as well as two HDMI connectors supporting dual displays. Internal expansion options include three M.2 slots for SATA storage and wireless expansion modules, one SIM card slot, and one DDR4 SODIMM slot that supports up to 32GB memory.

The VIA AMOS-3007 ruggedized embedded system is available for purchase along with optional Wi-Fi, 4G LTE, and 4G LTE + GPS M.2 modules.

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