VIA Announces ARTIGO A5000 & VAB-5000: Supercharging Your Edge AI and IoT Experience

• VIA ARTiGO A5000: Featuring the MediaTek Genio 700 Octa-Core processor, this fanless ultra-compact form factor offers dual-band Wi-Fi 6 with BT 5.2 connectivity.

• VIA VAB-5000: Accelerates Edge AI with HDMI, USB 3.0, and dual-band Wi-Fi 6. Industry-standard Pico-ITX form factor offers versatile expansion and integration options.

• Experience VIA’s cutting-edge tech firsthand at Tokyo Big Sight on April 24.

Taipei, Taiwan, April 17, 2024 – VIA Technologies, Inc. today announced the VIA SOM-5000 and ARTiGO A5000 featuring the MediaTek Genio 700 octa-core at Japan IT Week.

“We are proud to unveil our latest innovations in smart edge and IoT solutions at Tokyo Big Sight this April,”said Epan Wu, General Manager, VIA Intelligent Solutions.” The VIA ARTiGO A5000 system and VIA VAB-5000 board, both powered by the MediaTek Genio 700 processor, empower developers and innovators with a powerful and flexible platform for creating a wide range of groundbreaking applications across commercial, consumer, and industrial sectors.”

VIA ARTiGO A5000: A Compact Powerhouse for IoT Innovation

At the heart of VIA’s showcase is the VIA ARTiGO A5000, a testament to the company’s commitment to pushing the boundaries of compact computing. Powered by the MediaTek Genio 700 Octa-Core processor, this fanless, ultra-compact system is a marvel of engineering, designed to support the rigorous demands of smart edge computing and IoT innovations.

The ARTiGO A5000’s capabilities are vast, supporting 4K hardware-accelerated H.265/ H.264 video encoding and decoding, alongside the MediaTek Deep Learning Accelerator (MDLA) 3.0 and Vision Processor 6 (VP6) APU for accelerated AI processing and HiFi 5 audio processing. Its plethora of I/O features—including HDMI, USB 3.0 ports, and dual-band Wi-Fi 6 connectivity—makes it an ideal choice for a wide array of applications, from video monitoring and energy management systems to advanced POS solutions.

VIA VAB-5000: Accelerating Edge AI Developments

Complementing the ARTiGO A5000, the VIA VAB-5000 board is set to captivate attendees with its potent combination of performance and flexibility. Embedded with the MediaTek Genio 700 octa-core processor, this board is a powerhouse designed for the development of advanced edge AI systems and devices.

With its industry-standard Pico-ITX form factor, the VAB-5000 offers an impressive array of expansion options and supports a variety of display and camera integration options, making it perfectly suited for the most demanding industrial, commercial, and consumer use cases.

Software Solutions to Speed Up Time to Market

Understanding the need for speed in today’s fast-paced tech landscape, VIA offers comprehensive software support for both the ARTiGO A5000 system and the VAB-5000 board. With support for Android 13.0, Yocto 4.0, and Debian 12, along with a full suite of software customization services, VIA ensures that developers can minimize development costs and accelerate time to market for their innovative solutions.

Join Us at Tokyo Big Sight

Experience the future of compact computing and edge AI technology firsthand at booth 30-2, Tokyo Big Sight, from April 24th to 26th, 2024. Whether you’re a developer, business leader, or technology enthusiast, VIA Technologies invites you to explore innovations that redefine interactions with smart edge and IoT devices. Visit VIA’s event page for hardware specifications, software support, and ordering information. Don’t miss this chance to unlock the full potential of compact computing and elevate your edge AI and IoT innovations with VIA Technologies.

About VIA Technologies, Inc.

VIA Technologies, Inc. is a global leader in the design and development of intelligent automotive, industrial, building, and edge solutions for the most demanding use cases and deployment environments. Headquartered in Taipei, Taiwan, VIA operates a global network that links the high-tech centers of the US, Asia, and Europe and spans a customer base that includes many of the world’s leading hi-tech, manufacturing, and transportation enterprises.