SOM-5000, VAB-5000, and ARTiGO A5000 – Powered by Mediatek Genio and Designed for Industrial, Commercial and Consumer Applications
Taipei, Taiwan, 1 August 2024 – VIA Technologies, Inc., a leading innovator in the development of embedded platforms and systems, today announced the launch of three new high-performance edge AI solutions: the
SOM-5000,
VAB-5000, and
ARTiGO A5000. These platforms are designed to meet the growing demand for intelligent edge computing across a wide range of industrial, commercial, and consumer applications.
“These new platforms represent a significant leap forward in edge AI technology,” said Epan Wu, General Manager, VIA Intelligent Solutions. “With their advanced processing capabilities and versatile connectivity options, the SOM-5000, VAB-5000, and ARTiGO A5000 enable our customers to develop innovative and efficient edge AI applications.”
VIA SOM-5000
The VIA SOM-5000 is a fanless, low-power system-on-module designed for advanced edge AI applications. Powered by the MediaTek Genio 700 Octa-Core SoC, it features an integrated AI processor for high-efficiency Edge AI tasks, 4K hardware-accelerated H.265/H.264 video processing, support for dual displays and dual MIPI CSI-2 cameras, and optional 4G LTE mobile broadband with onboard M.2 and SIM card slots for enhanced connectivity.
VIA VAB-5000
The VIA VAB-5000 is a versatile Pico-ITX board engineered for flexible Edge AI deployments. Featuring the MediaTek Genio 700 Octa-Core SoC, it includes the MediaTek Deep Learning Accelerator 3.0 and Vision Processor 6 APU for advanced AI processing, 4K hardware-accelerated H.265/H.264 video encoding and decoding, compatibility with MIPI CSI, AHD cameras, and eDP/LVDS displays, and extensive I/O options including a 40-pin Raspberry Pi-type GPIO header.
VIA ARTiGO A5000
The VIA ARTiGO A5000 is an ultra-compact system crafted for edge AI applications, also powered by the MediaTek Genio 700 Octa-Core processor. It offers an integrated AI processor for sophisticated Edge AI applications, 4K hardware-accelerated H.265/H.264 video encoding and decoding, dual-band Wi-Fi 6 for robust connectivity, and comprehensive I/O options including HDMI, USB 3.1, and a MicroSD card slot.
About VIA Technologies, Inc.
VIA Technologies, Inc. is a global leader in the design and development of intelligent automotive, industrial, building, and edge solutions for the most demanding use cases and deployment environments. Headquartered in Taipei, Taiwan, VIA operates a global network that links the high-tech centers of the US, Asia, and Europe and spans a customer base that includes many of the world’s leading hi-tech, manufacturing, and transportation enterprises. For further information, visit our
website, or follow us on
LinkedIn.
