VIA SOM-7000

The VIA SOM-7000 module is powered by a MediaTek Genio 1200 Octa-Core Processor combining four Cortex-A78 cores running at 2.2GHz and four Cortex-A55 cores running at 2.0GHz with an integrated AI processor providing up to 4.8 TOPS for deep learning, neural network acceleration, computer vision applications and HiFi4 audio processing.

When combined with the VIA SOMDB7 carrier board, the VIA SOM-7000 module provides a wealth of camera and display integration options, including support for two MIPI CSI-2 cameras, a MIPI DSI display, plus, two HDMI and LVDS displays each. High-speed connectivity can be enabled through dual-band Wi-Fi 6, two Gigabit Ethernet ports, an integrated SIM card slot, and an M.2 B-Key slot for optional 4G LTE. Two USB 3.1 ports, an ADC/GPIO pin header, an M.2 E-Key slot, and a MicroSD card slot allow additional I/O configuration.

The VIA SOM-7000 module is based on the SMARC 2.11 form factor with dimensions of 82mm x 80mm (3.22″ x 3.15″) and comes with a two-sided heat spreader. The VIA SOMDB7 carrier board is based on an SBC form factor measuring 151mm x 134mm (5.94″ x 5.28″). For the full hardware specifications of the VIA SOM-7000 module and VIA SOMDB7 carrier board, download the datasheet.

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